AI Integration Everywhere by Intel with Fabless Silicon Mobility SoCs and Other Chips
Intel has made a significant stride in the automotive industry with the unveiling of a new family of AI-enhanced software-defined vehicle system-on-chips (SoCs). This move aligns with Intel's sustainability goals and addresses a critical energy management need for the industry.
The new family of SoCs, designed to address the industry's need for power and performance scalability, features AI acceleration capabilities from Intel's AI PC roadmap. This will enable various AI use cases, such as driver and passenger monitoring.
In a bid to drive its AI strategy into the automotive market, Intel has announced a deal to acquire Silicon Mobility, a fabless automotive silicon and software company that specializes in EV energy management SoCs. This acquisition is expected to help Intel address a critical energy management need for the industry.
Geely's Zeekr brand will be the first Original Equipment Manufacturer (OEM) to use Intel's new family of SDV SoCs. The ability to mix and match chiplets in these SoCs further eliminates the risk of vendor lock-in and fosters a more scalable software-defined architecture. Forward-compatibility on Intel systems combined with Intel AI acceleration will allow Zeekr to continually scale and upgrade services for next-gen experiences, such as generative AI-based voice assistants.
Intel has also committed to deliver the industry's first open UCIe-based chiplet platform for software-defined vehicles (SDVs). This commitment marks the first automotive supplier to support the integration of third-party chiplets into its automotive products.
In a joint effort with SAE International, Intel will chair a new industry-defining international standard for EV power management. The committee, which includes industry representation from Stellantis, HERE, and Monolithic Power Solutions (MPS), aims to accelerate progress by adopting and enhancing advanced power management concepts from the PC industry. The new standard, inspired by proven-in-use power management techniques from the PC industry's ACPI standard, is open to additional industry participation. The goal is to deliver the first draft standard within 12 to 18 months.
To ensure Intel's advanced chiplet packaging technologies meet the strict quality and reliability requirements necessary for automotive use cases, Intel has announced its intent to work with R&D hub imec. This collaboration will help Intel deliver on its promise of providing the industry's first open UCIe-based chiplet platform for SDVs.
Jack Weast, vice president and general manager of Intel Automotive, stated that Intel is taking a 'whole vehicle' approach to solving industry challenges. This approach underscores Intel's commitment to driving innovation in the automotive industry and contributing to its sustainable growth.
Besides Intel, companies such as Ford, General Motors, Toyota, Bosch, and Nissan are members of the SAE International committee for developing the new automotive standard for vehicle platform power supply. This collaboration underscores the industry's commitment to adopting advanced power management concepts to drive sustainable growth and innovation.
